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What are the difficulties in the production of multilayer circuit boards?-Jiangmen Jingchuangda Electronics Co., Ltd. Location:Home » News » Industry News

What are the difficulties in the production of multilayer circuit boards?


PCB is becoming more and more meticulous, and the production difficulty is getting bigger and bigger. The higher the corresponding number of layers, the higher the cost of PCB proofing for multi-layer circuit boards. So what are the difficulties in the production of multilayer circuit boards? Next, let's follow the Jingchuangda manufacturers to find out.

1. Difficulties in making inner circuit of multilayer PCB proofing

The multilayer circuit has various special requirements for high speed, thick copper, high frequency, and high Tg value. The requirements for inner layer wiring and pattern size control are getting higher and higher. For example, the ARM development board has a lot of impedance signal lines in the inner layer. To ensure the integrity of the impedance increases the difficulty of the inner line production.

There are many signal lines in the inner layer, and the width and spacing of the lines are basically about 4mil or less; the thin production of multi-core boards is prone to wrinkles, and these factors will increase the production of the inner layer.

Suggestion: design the line width and line spacing above 3.5/3.5mil (most factories have no difficulty in production).

For example, a six-layer board, it is recommended to use a fake eight-layer structure design, which can meet the impedance requirements of 50ohm, 90ohm, and 100ohm in the inner layer of 4-6mil.

2. Difficulties in alignment between inner layers of multi-layer PCB proofing

The number of multi-layer boards is increasing, and the alignment requirements of the inner layers are getting higher and higher. The film will expand and contract due to the influence of the temperature and humidity of the workshop environment, and the core board will have the same expansion and contraction when produced, which makes it more difficult to control the alignment accuracy between the inner layers.

3. Difficulties of multi-layer PCB proofing and pressing process

The superposition of multiple core plates and PP (prepreg) is prone to problems such as delamination, sliding plate and steam drum residues during pressing. In the structural design process of the inner layer, various factors such as the dielectric thickness between the layers, the glue flow, and the heat resistance of the sheet should be considered, and the corresponding laminated structure should be reasonably designed.

Recommendation: Keep the inner layer of copper spread evenly, and spread the copper in different areas of a large area with the same balance as PAD.

4. Difficulties in the production of multi-layer PCB proofing drilling

The multi-layer board uses high Tg or other special plates, and the roughness of the drilling of different materials is different, which increases the difficulty of removing the slag in the hole. High-density multi-layer boards have high hole density and low production efficiency, which is easy to break. Between the via holes of different networks, the edge of the hole is too close to cause the CAF effect problem.

Recommendation: The distance between the edges of the holes of different networks is ≥0.3mm.

The above are the difficulties in the production of multilayer circuit boards. For more information on the production of multilayer circuit boards, please contact Jingchuangda circuit board manufacturer.

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